CHN:603986

GigaDevice Semiconductor Inc. engages in the research, development, technical support, and sale of memory, microcontrollers, sensors, and analog chips. The company offers SPI NOR, SPI NAND, parallel NAND, wafer level chip scale packaging (WLCSP), and known good die (KGD) flash products; 32-bit microcontrollers (MCUs), such as high-performance, mainstream, entry-level, low-power consumptions, automotive, and specific MCUs, as well as wireless MCUs and modules; and sensors comprising touch controllers, fingerprint recognition, and barometric pressure sensors. It also provides analogs consisting of general power supply products, including low drop linear regulators and DC-DC converters; application specific standard products (ASSP), such as ASSP for DDR and power management IC for TWS earbuds; motor drivers comprising 3-Phase MOSFET pre-drivers, brushed DC motor drivers, multi-channel full-bridge drivers, and brushless DC motor driver SOCs; charging management products, such as battery charger and protection ICs; signal chain products which include ADC, operation amplifiers, comparators, high precision voltage references, current monitors, and temperature/temperature humidity sensors; and BMS AFE products. Its products are used in automotive, industrial, PC and peripherals, consumer electronics, Internet of Things, network communication, and mobile applications. The company sells its products through operations and distributor networks in China, Singapore, the United States, South Korea, Japan, the United Kingdom, Germany, Turkey, Italy, and Mexico. The company was formerly known as GigaDevice Semiconductor (Beijing) Inc. and changed its name to GigaDevice Semiconductor Inc. in August 2022. GigaDevice Semiconductor Inc. was founded in 2005 and is headquartered in Beijing, China.